Start Over
You searched for: subject "Microelectronic packaging+Materials."

Search Results

Cover image for Polymers in microelectronics

Polymers in microelectronics

Location Call # Status
Joyner - General Stacks TK7874 .S628 1989 ✔ Available
Cover image for Adhesion in microelectronics

Adhesion in microelectronics

  • 2014
  • Format: Electronic
Location
Access Content Online
Cover image for Microelectronics technology

Microelectronics technology

  • 1995
  • Format: Electronic
Location
Access Content Online
Cover image for ... IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics and ... IEEE Interdisciplinary Conference on Portable Information Devices

... IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics and ... IEEE Interdisciplinary Conference on Portable Information Devices

Location
Access Content Online
Cover image for LCP for microwave packages and modules

LCP for microwave packages and modules

  • 2012
  • Format: Book
Location Call # Status
Joyner - General Stacks TK7876 .L387 2012 ✔ Available
Cover image for Polytronic 2005

Polytronic 2005

Location
Access Content Online
Cover image for 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Location
Access Content Online
Cover image for POLYTRONIC 2002

POLYTRONIC 2002

Location
Access Content Online
Cover image for Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Location
Access Content Online
Cover image for LCP for microwave packages and modules

LCP for microwave packages and modules

  • 2012
  • Format: Electronic
Location
Access Content Online