Polytronic 2005 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings / IEEE, IEEE Components, Packaging and Manufacturing Technology Society, Wrocław Technical University.

Author/creator International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Other author Institute of Electrical and Electronics Engineers.
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway, NJ : IEEE,
Descriptionx, 235 p. : ill. ; 30 cm.
Supplemental ContentFull text available from IEEE Conference Proceedings Archive 2005-2009
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Subjects
Microelectronic packaging--Materials. --Congresses.
Polymers--Congresses.
Integrated circuits--Reliability. --Congresses.
Photonics--Materials. --Congresses.
Polymeric composites--Congresses.

General note"IEEE Catalog Number 05TH8855".
Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2006274528
ISBN0780395530 (pbk.)

Availability

Library Location Call Number Status Item Actions
Electronic Resources ✔ Available