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LEADER 02558nam a2200469 a 4500

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010 a| 95044669;

020 a| 0841233322 (acid-free paper);

035 a| (WaSeSS)ssj0000596884;

040 a| DLCc| DLCd| DLCd| WaSeSS;

049 a| EREEa| NEHH;

050 00 a| TK7874b| .M475 1995;

082 00 a| 621.381/0462| 20;

245 00 a| Microelectronics technologyh| [electronic resource] :b| polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /c| Elsa Reichmanis ... [et al., editors].;

260 a| Washington, DC :b| American Chemical Society,;

300 a| xii, 563 p. :b| ill. ;c| 24 cm.;

440 0 a| ACS symposium series ;v| 614;

504 a| Includes bibliographical references and indexes.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Microelectronic packagingx| Materialsx| Congresses.=| ^A269388;

650 0 a| Polymersx| Congresses.=| ^A10854;

650 0 a| Photoresistsx| Congresses.=| ^A242942;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Reichmanis, Elsa,d| 1953-?| UNAUTHORIZED;

710 2 a| American Chemical Society.b| Division of Polymeric Materials: Science and Engineering.=| ^A638029;

710 2 a| Kōbunshi Gakkai (Japan).b| Polymers for Microelectronics Division.?| UNAUTHORIZED;

710 2 a| American Chemical Society.b| Meetingn| (209th :d| 1995 :c| Anaheim, Calif.)?| UNAUTHORIZED;

856 40 z| Full text available from ACS eBooks Complete Collectionu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fpubs.acs.org%2Fdoi%2Fbook%2F10.1021%2Fbk-1995-0614;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

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596 a| 1 3 4;

998 a| 6731851;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6731851-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 6/13/2026x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6731851-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 6/13/2026x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6731851-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 6/13/2026x| EBOOKz| JERESOURCE;

Microelectronics technology polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 / Elsa Reichmanis ... [et al., editors].

Format	Electronic
Publication Info	Washington, DC : American Chemical Society,
Description	xii, 563 p. : ill. ; 24 cm.
Supplemental Content	Full text available from ACS eBooks Complete Collection
Subjects	Microelectronic packaging--Materials. --Congresses. Polymers--Congresses. Photoresists--Congresses.

Other author/creator	Reichmanis, Elsa, 1953-
Other author/creator	American Chemical Society. Division of Polymeric Materials: Science and Engineering.
Other author/creator	Kōbunshi Gakkai (Japan). Polymers for Microelectronics Division.
Other author/creator	American Chemical Society. Meeting 1995 : Anaheim, Calif.) (209th :
Series	ACS symposium series ; 614
Bibliography note	Includes bibliographical references and indexes.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	95044669
ISBN	0841233322 (acid-free paper)

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