Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Odaiba, Tokyo, Japan, January 15-18, 2007 s / IEEE Components, Packaging and Manufacturing Technology Society.

Author/creator International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Other author Institute of Electrical and Electronics Engineers.
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway, NJ : IEEE,
Descriptionxii, 310 p. : ill. ; 30 cm.
Descriptionp. cm.
Supplemental ContentFull text available from IEEE Conference Proceedings Archive 2005-2009
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Subjects
Microelectronic packaging--Materials. --Congresses.
Polymers--Congresses.
Integrated circuits--Reliability. --Congresses.
Photonics--Materials. --Congresses.
Polymeric composites--Congresses.

General note"IEEE Catalog Number 07TH88956".
Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2007924339
ISBN1424411300 (softbound edition)

Availability

Library Location Call Number Status Item Actions
Electronic Resources ✔ Available