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LEADER 02169cam a2200493 i 4500

001 ssj0001288113;

003 WaSeSS;

005 20190712081240.0;

006 m d ;

007 cr n ;

008 140805s2014 nju sb 001 0 eng d;

010 a| 2014031115;

020 a| 9781118831342 (epub);

020 a| 9781118831359 (pdf);

020 z| 9781118831335 (cloth : alk. paper);

035 a| (WaSeSS)ssj0001288113;

042 a| pcc;

049 a| EREEa| NEHH;

050 00 a| TK7870.15;

082 00 a| 621.381/0462| 23;

245 00 a| Adhesion in microelectronicsh| [electronic resource] /c| edited by K.L. Mittal and Tanweer Ahsan.;

260 a| Hoboken, New Jersey :b| John Wiley and Sons, Inc.,c| [2014];

300 a| 1 online resource.;

504 a| Includes bibliographical references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

588 a| Description based on print version record and CIP data provided by publisher.;

650 0 a| Microelectronic packagingx| Materials.=| ^A269388;

650 0 a| Adhesives.=| ^A636;

650 0 a| Adhesive joints.=| ^A87575;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Mittal, K. L.,d| 1945-=| ^A550214;

700 1 a| Ahsan, Tanweer.?| UNAUTHORIZED;

776 08 i| Print version:t| Adhesion in microelectronicsd| Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]z| 9781118831335w| (DLC) 2014029765;

856 40 z| Full text available from Ebook Central - Academic Completeu| https://ebookcentral.proquest.com/lib/eastcarolina/detail.action?docID=1767917;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 4434570;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4434570-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 6/27/2016x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4434570-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 6/27/2016x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4434570-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 6/27/2016x| EBOOKz| JERESOURCE;

Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

Other author	Mittal, K. L., 1945-
Other author	Ahsan, Tanweer.
Format	Electronic
Publication Info	Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
Description	1 online resource.
Supplemental Content	Full text available from Ebook Central - Academic Complete
Subjects	Microelectronic packaging--Materials. Adhesives. Adhesive joints.

Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Source of description	Description based on print version record and CIP data provided by publisher.
Issued in other form	Print version: Adhesion in microelectronics Hoboken, New Jersey : John Wiley and Sons, Inc., [2014] 9781118831335
Genre/form	Electronic books.
LCCN	2014031115
ISBN	9781118831342 (epub)
ISBN	9781118831359 (pdf)

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Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

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