Tools

LEADER 03495cam a2200505 a 4500

001 ocn772971652;

003 OCoLC;

005 20141212053933.0;

008 120405s2012 enk b 001 0 eng ;

010 a| 2012007343;

019 a| 761858519;

020 a| 9781107003781 (hardback);

020 a| 1107003784 (hardback);

035 a| (Sirsi) 40022116496;

035 a| 40022116496;

035 a| (OCoLC)772971652z| (OCoLC)761858519;

042 a| pcc;

050 00 a| TK7876b| .L387 2012;

082 00 a| 621.381/32| 23;

084 a| TEC0240002| bisacsh;

245 00 a| LCP for microwave packages and modules /c| [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.;

260 a| Cambridge ;a| New York :b| Cambridge University Press,c| 2012.;

300 a| xiv, 253 pages ;c| 26 cm.;

336 a| text2| rdacontent;

337 a| unmediated2| rdamedia;

338 a| volume2| rdacarrier;

490 1 a| The Cambridge RF and microwave engineering series;

520 a| "A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering"--c| Source other than Library of Congress .;

504 a| Includes bibliographical references and index.;

505 0 a| Introduction to electronic package engineering -- Characteristics of liquid crystal polymer (LCP) / Morgan J. Chen, Kunia Aihara, Cheng Chen, Anh-Vu H. Pham -- Fabrication techniques for processing LCP -- LCP for wafer-level chip-scale MEMS -- LCP for surface mount interconnects, packages, and modules -- LCP for passive components / Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samuel Chieh, Anh-Vu H. Pham -- LCP for system design / Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samuel Chieh, Anh-Vu H. Pham -- LCP reliability.;

650 0 a| Microwave devicesx| Materials.=| ^A84979;

650 0 a| Microelectronic packagingx| Materials.=| ^A269388;

650 0 a| Liquid crystal devices.=| ^A72760;

650 0 a| Polymer liquid crystals.=| ^A214277;

650 7 a| TECHNOLOGY & ENGINEERING / Microwaves.2| bisacsh;

700 1 a| Pham, Anh-Vu H.=| ^A1151235;

700 1 a| Chen, Morgan J.=| ^A1151236;

700 1 a| Aihara, Kunia.=| ^A1151237;

830 0 a| Cambridge RF and microwave engineering series.=| ^A1040936;

949 i| 30372013799777o| jjlm;

960 o| 1s| 120.00t| Joyner48u| JAPPz| USD;

596 a| 1;

998 a| 3317529;

999 a| TK7876 .L387 2012w| LCc| 1i| 30372013799777l| JGESm| JOYNERr| Ys| Yt| JGESBKu| 5/14/2013x| BOOKz| JSTACKSo| .STAFF. jjlm;

LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

Other author	Pham, Anh-Vu H.
Other author	Chen, Morgan J.
Other author	Aihara, Kunia.
Format	Book
Publication Info	Cambridge ; New York : Cambridge University Press, 2012.
Description	xiv, 253 pages ; 26 cm.
Subjects	Microwave devices--Materials. Microelectronic packaging--Materials. Liquid crystal devices. Polymer liquid crystals.

Series	The Cambridge RF and microwave engineering series Cambridge RF and microwave engineering series. ^A1040936
Contents	Introduction to electronic package engineering -- Characteristics of liquid crystal polymer (LCP) / Morgan J. Chen, Kunia Aihara, Cheng Chen, Anh-Vu H. Pham -- Fabrication techniques for processing LCP -- LCP for wafer-level chip-scale MEMS -- LCP for surface mount interconnects, packages, and modules -- LCP for passive components / Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samuel Chieh, Anh-Vu H. Pham -- LCP for system design / Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samuel Chieh, Anh-Vu H. Pham -- LCP reliability.
Abstract	"A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering"-- Source other than Library of Congress .
Bibliography note	Includes bibliographical references and index.
LCCN	2012007343
ISBN	9781107003781 (hardback)
ISBN	1107003784 (hardback)

Availability

Library	Location	Call Number	Status	Item Actions
Joyner	General Stacks	TK7876 .L387 2012	✔ Available	Place Hold

LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

Click here for more information about this title

Availability