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Cover image for Parametric design study of a power electronics package

Parametric design study of a power electronics package

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Cover image for Wire bonding in microelectronics

Wire bonding in microelectronics

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Joyner - General Stacks TK7836 .H366 2010 ✔ Available
Cover image for Advanced wirebond interconnection technology

Advanced wirebond interconnection technology

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Cover image for Wire bonding in microelectronics

Wire bonding in microelectronics

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Cover image for Lead-free solder interconnect reliability

Lead-free solder interconnect reliability

  • 2005
  • Format: Electronic
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Cover image for Thermal and structural electronic packaging analysis for space and extreme environments

Thermal and structural electronic packaging analysis for space and extreme environments

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Cover image for Polytronic 2005

Polytronic 2005

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Cover image for 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Cover image for POLYTRONIC 2002

POLYTRONIC 2002

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Cover image for Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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