Tools

LEADER 02356cam a2200625 a 4500

001 ocn261924687;

003 OCoLC;

005 20141212054148.0;

008 100420s2010 nyua b 001 0 eng ;

010 a| 2010287045;

015 a| GBA8B59442| bnb;

015 a| GBA9B07012| bnb;

016 7 a| 0147711392| Uk;

016 7 a| 0154210182| Uk;

019 a| 225873612a| 467747065;

020 a| 9780071476232;

020 a| 0071476237;

020 a| 9780071703345 (CD-ROM);

020 a| 0071703349 (CD-ROM);

020 a| 007170101X (hbk.);

020 a| 9780071701013 (hbk.);

029 1 a| CDXb| 8279912;

029 1 a| NZ1b| 13218284;

029 1 a| AU@b| 000046028865;

029 1 a| AU@b| 000045435305;

035 a| (Sirsi) o261924687;

035 a| (OCoLC)261924687;

049 a| EREE;

050 00 a| TK7836b| .H366 2010;

082 04 a| 621.3812| 22;

100 1 a| Harman, George G.=| ^A598116;

245 10 a| Wire bonding in microelectronics /c| George G. Harmon.;

250 a| 3rd ed.;

300 a| xx, 426 pages :b| illustrations ;c| 24 cm +e| 1 CD-ROM (4 3/4 in.);

336 a| text2| rdacontent;

337 a| unmediated2| rdamedia;

338 a| volume2| rdacarrier;

500 a| Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.;

504 a| Includes bibliographical references and index.;

650 0 a| Wire bonding (Electronic packaging)x| Production control.=| ^A870274;

650 0 a| Electronic packagingx| Reliability.=| ^A241674;

650 0 a| Electronic packagingx| Defects.=| ^A241674;

650 0 a| Semiconductorsx| Failures.=| ^A303437;

700 1 a| Harman, George G.t| Reliability and yield problems of wire bonding in microelectronics.=| ^A598116;

994 a| C0b| ERE;

938 a| Blackwell Book Serviceb| BBUSn| R7828034c| $89.95;

938 a| Coutts Information Servicesb| COUTn| 8279912c| £49.99;

938 a| Baker and Taylorb| BTCPn| BK0007755933;

938 a| Baker & Taylorb| BKTYc| 89.95d| 89.95i| 0071476237n| 0007755933s| active;

938 a| YBP Library Servicesb| YANKn| 2833308;

596 a| 1;

998 a| 2377336;

999 a| TK7836 .H366 2010w| LCc| 1i| 30372014758244d| 11/4/2020e| 9/23/2020f| 4/3/2013g| 2l| JGESm| JOYNERn| 2r| Ys| Yt| JGESBKu| 12/2/2010x| BOOKz| JSTACKSo| .STAFF. jmpl;

Wire bonding in microelectronics / George G. Harmon.

Author/creator	Harman, George G.
Other author	Harman, George G.
Format	Book
Edition	3rd ed.
Publication Info	New York : McGraw-Hill, ©2010.
Description	xx, 426 pages : illustrations ; 24 cm + 1 CD-ROM (4 3/4 in.)
Subjects	Wire bonding (Electronic packaging)--Production control. Electronic packaging--Reliability. Electronic packaging--Defects. Semiconductors--Failures.

General note	Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Bibliography note	Includes bibliographical references and index.
LCCN	2010287045
ISBN	9780071476232
ISBN	0071476237
ISBN	9780071703345 (CD-ROM)
ISBN	0071703349 (CD-ROM)
ISBN	007170101X (hbk.)
ISBN	9780071701013 (hbk.)

Availability

Library	Location	Call Number	Status	Item Actions
Joyner	General Stacks	TK7836 .H366 2010	✔ Available	Place Hold

Wire bonding in microelectronics / George G. Harmon.

Click here for more information about this title

Availability