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010 a| 2010287045;

020 a| 9780071476232;

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040 a| DLCc| DLCd| DLCd| WaSeSS;

049 a| EREEa| NEHH;

050 00 a| TK7836b| .H366 2010;

100 1 a| Harman, George G.=| ^A598116;

245 10 a| Wire bonding in microelectronicsh| [electronic resource] /c| George G. Harmon.;

250 a| 3rd ed.;

260 a| New York :b| McGraw-Hill,;

300 a| xx, 426 p. :b| ill. ;c| 24 cm. +e| 1 CD-ROM (4 3/4 in.);

500 a| Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Wire bonding (Electronic packaging)x| Production control.=| ^A870274;

650 0 a| Electronic packagingx| Reliability.=| ^A241674;

650 0 a| Electronic packagingx| Defects.=| ^A241674;

650 0 a| Semiconductorsx| Failures.=| ^A303437;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Harman, George G.t| Reliability and yield problems of wire bonding in microelectronics.=| ^A598116;

856 40 z| Full text available from AccessEngineeringu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fwww.accessengineeringlibrary.com%2Fcontent%2Fbook%2F9780071476232;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

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596 a| 1 3 4;

998 a| 5200924;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5200924-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 11/2/2019x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5200924-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 11/2/2019x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5200924-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 11/2/2019x| EBOOKz| JERESOURCE;

Wire bonding in microelectronics / George G. Harmon.

Author/creator	Harman, George G.
Other author	Harman, George G.
Format	Electronic
Edition	3rd ed.
Publication Info	New York : McGraw-Hill,
Description	xx, 426 p. : ill. ; 24 cm. + 1 CD-ROM (4 3/4 in.)
Supplemental Content	Full text available from AccessEngineering
Subjects	Wire bonding (Electronic packaging)--Production control. Electronic packaging--Reliability. Electronic packaging--Defects. Semiconductors--Failures.

General note	Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2010287045
ISBN	9780071476232

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Wire bonding in microelectronics / George G. Harmon.

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