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Cover image for Fundamentals of device and systems packaging

Fundamentals of device and systems packaging

  • 2019
  • Second edition
  • Format: Electronic
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Cover image for Microwave and millimeter-wave electronic packaging

Microwave and millimeter-wave electronic packaging

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Cover image for Advanced MEMS packaging

Advanced MEMS packaging

  • 2010
  • Format: Book
Location Call # Status
Joyner - General Stacks TK7875 .A378 2010 ✔ Available
Cover image for Modeling and simulation for microelectronic packaging assembly

Modeling and simulation for microelectronic packaging assembly

Location Call # Status
Joyner - General Stacks TK7870.15 .L58 2011 ✔ Available
Cover image for Wide bandgap power semiconductor packaging

Wide bandgap power semiconductor packaging

  • 2018
  • Format: Electronic
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Cover image for Polymers in microelectronics

Polymers in microelectronics

Location Call # Status
Joyner - General Stacks TK7874 .S628 1989 ✔ Available
Cover image for Thermal stress and strain in microelectronics packaging

Thermal stress and strain in microelectronics packaging

  • 1993
  • Format: Book
Location Call # Status
Joyner - General Stacks TK7870.15 .T48 1993 ✔ Available
Cover image for Microelectronics packaging handbook

Microelectronics packaging handbook

  • 1989
  • Format: Book
Location Call # Status
Joyner - General Stacks TK7874 .M485 1989 ✔ Available
Cover image for Modeling and simulation for microelectronic packaging assembly

Modeling and simulation for microelectronic packaging assembly

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Cover image for Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches

Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches

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