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LEADER 01209cam a2200349 a 4500

001 ocm27107879;

003 OCoLC;

005 20141212112448.0;

008 921123s1993 nyua b 001 0 eng ;

010 a| 92043285;

015 a| GB94-4316;

020 a| 0442010583;

035 a| (Sirsi) o27107879;

035 a| (OCoLC)27107879;

049 a| EREE;

050 00 a| TK7870.15b| .T48 1993;

082 00 a| 621.381/0462| 20;

245 00 a| Thermal stress and strain in microelectronics packaging /c| edited by John H. Lau.;

300 a| xxii, 883 pages :b| illustrations ;c| 24 cm;

336 a| text2| rdacontent;

337 a| unmediated2| rdamedia;

338 a| volume2| rdacarrier;

504 a| Includes bibliographical references and index.;

650 0 a| Electronic packaging.=| ^A241674;

650 0 a| Microelectronic packaging.=| ^A269388;

650 0 a| Thermal stresses.=| ^A332371;

700 1 a| Lau, John H.=| ^A322652;

596 a| 1;

998 a| 545877;

999 a| TK7870.15 .T48 1993w| LCc| 1i| 30372008183375d| 3/23/2017e| 2/27/2017f| 4/3/2013g| 3l| JGESm| JOYNERn| 4p| $89.95r| Ys| Yt| JGESBKu| 1/3/1994x| BOOKz| JSTACKSo| .STAFF. 0;

Thermal stress and strain in microelectronics packaging / edited by John H. Lau.

Other author	Lau, John H.
Format	Book
Publication Info	New York : Van Nostrand Reinhold, ©1993.
Description	xxii, 883 pages : illustrations ; 24 cm
Subjects	Electronic packaging. Microelectronic packaging. Thermal stresses.

Bibliography note	Includes bibliographical references and index.
LCCN	92043285
ISBN	0442010583

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Library	Location	Call Number	Status	Item Actions
Joyner	General Stacks	TK7870.15 .T48 1993	✔ Available	Place Hold

Thermal stress and strain in microelectronics packaging / edited by John H. Lau.

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