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001 ocn699765387;

003 OCoLC;

005 20141212015738.0;

008 110509s2011 ch a b 001 0 eng ;

010 a| 2011019534;

016 7 a| 0158367642| Uk;

020 a| 9780470827802 (hardback);

020 a| 0470827807 (hardback);

020 a| 9780470827819 (PDF);

020 a| 0470827815 (PDF);

020 a| 9780470827826 (oBook);

020 a| 0470827823 (oBook);

020 a| 9780470828410 (ePub);

020 a| 0470828412 (ePub);

020 a| 9781118082829 (Mobi);

020 a| 1118082826 (Mobi);

029 1 a| AU@b| 000047148716;

035 a| (Sirsi) o699765387;

035 a| (OCoLC)699765387;

042 a| pcc;

049 a| EREE;

050 00 a| TK7870.15b| .L58 2011;

082 00 a| 621.381/0462| 23;

084 a| TEC0080102| bisacsh;

100 1 a| Liu, S.q| (Sheng),d| 1963-=| ^A1090653;

245 10 a| Modeling and simulation for microelectronic packaging assembly :b| manufacturing, reliability, and testing /c| Sheng Liu, Yong Liu.;

300 a| xxii, 564 pages :b| illustrations ;c| 26 cm;

336 a| text2| rdacontent;

337 a| unmediated2| rdamedia;

338 a| volume2| rdacarrier;

520 a| "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--c| Provided by publisher.;

504 a| Includes bibliographical references and index.;

650 0 a| Microelectronic packagingx| Simulation methods.=| ^A269388;

700 1 a| Liu, Yong,d| 1962-=| ^A1081703;

949 a| TK7870.15 .L58 2011h| JOYNER48o| jmpli| 30372016408988;

938 a| Baker and Taylorb| BTCPn| BK0009542692;

938 a| YBP Library Servicesb| YANKn| 4072828;

938 a| Blackwell Book Serviceb| BBUSn| 4072828;

938 a| Coutts Information Servicesb| COUTn| 15736132;

938 a| Ingramb| INGRn| 9780470827802;

994 a| C0b| ERE;

596 a| 1;

998 a| 2969218;

999 a| TK7870.15 .L58 2011w| LCc| 1i| 30372016408988d| 4/3/2013e| 4/23/2012f| 4/3/2013g| 3l| JGESm| JOYNERr| Ys| Yt| JGESBKu| 4/18/2012x| BOOKz| JSTACKSo| .STAFF. jmpl;

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.

Author/creator	Liu, S., 1963-
Other author	Liu, Yong, 1962-
Format	Book
Publication Info	[Beijing] : Chemical Industry Press ; Singapore : Wiley, 2011.
Description	xxii, 564 pages : illustrations ; 26 cm
Subjects	Microelectronic packaging--Simulation methods.

Abstract	"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.
Bibliography note	Includes bibliographical references and index.
LCCN	2011019534
ISBN	9780470827802 (hardback)
ISBN	0470827807 (hardback)
ISBN	9780470827819 (PDF)
ISBN	0470827815 (PDF)
ISBN	9780470827826 (oBook)
ISBN	0470827823 (oBook)
ISBN	9780470828410 (ePub)
ISBN	0470828412 (ePub)
ISBN	9781118082829 (Mobi)
ISBN	1118082826 (Mobi)

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Library	Location	Call Number	Status	Item Actions
Joyner	General Stacks	TK7870.15 .L58 2011	✔ Available	Place Hold

Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.

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