/LC.GIF&client=easterncarolinaedu)
Advanced MEMS packaging / John H. Lau [and others].
| Other author | Lau, John H. |
| Format | Book |
| Publication Info | New York : McGraw-Hill, ©2010. |
| Description | xxiii, 552 pages : illustrations ; 24 cm |
| Subjects |
| Variant title | Advanced microelectromechanical systems packaging |
| Contents | Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. |
| Bibliography note | Includes bibliographical references and index. |
| LCCN | 2009040456 |
| ISBN | 9780071626231 (alk. paper) |
| ISBN | 0071626239 (alk. paper) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Joyner | General Stacks | TK7875 .A378 2010 | ✔ Available | Place Hold |