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Cover image for 3D IC integration and packaging

3D IC integration and packaging

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Cover image for Through-silicon Vias for 3d Integration

Through-silicon Vias for 3d Integration

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Cover image for Reliability of RoHS-Compliant 2D and 3D IC interconnects

Reliability of RoHS-Compliant 2D and 3D IC interconnects

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Cover image for Advanced MEMS packaging

Advanced MEMS packaging

  • 2010
  • Format: Book
Location Call # Status
Joyner - General Stacks TK7875 .A378 2010 ✔ Available
Cover image for Advanced MEMS packaging

Advanced MEMS packaging

  • 2010
  • Format: Electronic
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Cover image for Electronics manufacturing

Electronics manufacturing

  • 2003
  • Format: Electronic
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Cover image for Microvias

Microvias

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Cover image for Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

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Cover image for Thermal stress and strain in microelectronics packaging

Thermal stress and strain in microelectronics packaging

  • 1993
  • Format: Book
Location Call # Status
Joyner - General Stacks TK7870.15 .T48 1993 ✔ Available