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010 a| 2015013446;

020 a| 9780071848060 (hardback : acid-free paper);

020 a| 9780071848077 (paperback : acid-free paper);

020 a| 0071848061 (acid-free paper);

035 a| (WaSeSS)ssj0001590311;

042 a| pcc;

049 a| EREEa| NEHH;

050 00 a| TK7874.893b| .L38 2016;

082 00 a| 621.38152| 23;

100 1 a| Lau, John H.=| ^A322652;

245 10 a| 3D IC integration and packagingh| [electronic resource] /c| John H. Lau, Ph.D.;

260 a| New York :b| McGraw-Hill Education,c| [2016];

300 a| xxii, 458 pages ;c| 25 cm;

504 a| Includes bibliographical references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Three-dimensional integrated circuits.=| ^A1172761;

650 0 a| Microelectronic packaging.=| ^A269388;

655 0 a| Electronic books.=| ^A491897;

856 40 z| Full text available from AccessEngineeringu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fwww.accessengineeringlibrary.com%2Fcontent%2Fbook%2F9780071848060;

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596 a| 1 3 4;

998 a| 5187460;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5187460-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 10/30/2019x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5187460-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 10/30/2019x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5187460-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 10/30/2019x| EBOOKz| JERESOURCE;

3D IC integration and packaging / John H. Lau, Ph.D.

Author/creator	Lau, John H.
Format	Electronic
Publication Info	New York : McGraw-Hill Education, [2016]
Description	xxii, 458 pages ; 25 cm
Supplemental Content	Full text available from AccessEngineering
Subjects	Three-dimensional integrated circuits. Microelectronic packaging.

Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2015013446
ISBN	9780071848060 (hardback : acid-free paper)
ISBN	9780071848077 (paperback : acid-free paper)
ISBN	0071848061 (acid-free paper)

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3D IC integration and packaging / John H. Lau, Ph.D.

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