Start Over
You searched for: author_facet Harman, George G.

Search Results

Cover image for Wire bonding in microelectronics

Wire bonding in microelectronics

Location
Access Content Online
Cover image for Wire bonding in microelectronics

Wire bonding in microelectronics

Location Call # Status
Joyner - General Stacks TK7836 .H366 2010 ✔ Available
Cover image for Nondestructive tests used to insure the integrity of semiconductor devices with emphasis on acoustic emission techniques

Nondestructive tests used to insure the integrity of semiconductor devices with emphasis on acoustic emission techniques

Location Call # Status
Joyner - Fed Docs Stacks C 13.10:400-59 ✔ Available
Cover image for Microelectronic ultrasonic bonding

Microelectronic ultrasonic bonding

Location Call # Status
Joyner - Fed Docs Stacks C 13.10:400-2 ✔ Available
Cover image for Application of capacitor microphones and magnetic pickups to the tuning and trouble shooting of microelectronic ultrasonic bonding equipment

Application of capacitor microphones and magnetic pickups to the tuning and trouble shooting of microelectronic ultrasonic bonding equipment

Location Call # Status
Joyner - Fed Docs Stacks C 13.46:573 ✔ Available