"Three-dimensional integrated circuits." - ECU Libraries Catalog

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Cover image for Through-silicon Vias for 3d Integration

Through-silicon Vias for 3d Integration

by Lau, John H.
2013
Format: Electronic

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Cover image for Design and modeling for 3D ICs and interposers

Design and modeling for 3D ICs and interposers

by Swaminathan, Madhavan
2014
Format: Electronic

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Cover image for Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement

by Ma, Yue
2019
Format: Electronic

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Cover image for 3D IC integration and packaging

3D IC integration and packaging

by Lau, John H.
2016
Format: Electronic

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Cover image for Three-dimensional integrated circuit design

Three-dimensional integrated circuit design

by Pavlidis, Vasilis F., 1976-
2017
Second edition
Format: Electronic

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Cover image for 3D integration of resistive switching memory

3D integration of resistive switching memory

2023
First edition
Format: Electronic

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Cover image for Design for high performance, low power, and reliable 3D integrated circuits

Design for high performance, low power, and reliable 3D integrated circuits

by Lim, Sung Kyu
2013
Format: Book

Location	Call #	Status
Joyner - General Stacks	TK7874.893 .L56 2013	✔ Available

Cover image for Vertical 3D memory technologies

Vertical 3D memory technologies

by Prince, Betty
2014
Format: Electronic

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Cover image for Three-dimensional integrated circuit design

Three-dimensional integrated circuit design

by Pavlidis, Vasilis F., 1976-
2009
Format: Electronic

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Cover image for 3D integration in VLSI circuits

3D integration in VLSI circuits

2018
Format: Electronic

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