Design and modeling for 3D ICs and interposers / Madhavan Swaminathan, Georgia Institute of Technology, USA ; Ki Jin Han, Ulsan National Institute of Science and Technology (UNIST), Korea.
| Author/creator | Swaminathan, Madhavan |
| Other author | Han, Ki Jin. |
| Format | Electronic |
| Publication Info | New Jersey : World Scientific, [2014] |
| Description | xxi, 354 pages : illustrations (some color) ; 24 cm. |
| Supplemental Content | Full text available from Ebook Central - Academic Complete |
| Subjects |
| Series | WSPC series in advanced integration and packaging ; vol. 2 WSPC series in advanced integration and packaging ; vol. 2. ^A1180215 |
| Incomplete content | System integration and modeling concepts -- Modeling of cylindrical interconnections -- Electrical modeling of through silicon vias -- Electrical performance and signal integrity -- Power distribution, return path discontinuities and thermal management -- Alternate methods for power distribution. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2015430728 |
| ISBN | 9789814508599 |
| ISBN | 9814508594 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |