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LEADER 02336nas a2200529 a 4500

001 ocm43437941;

003 OCoLC;

005 20141208175333.0;

007 he bmb024bbca;

008 000210c19949999dcuar b f0 0eng d;

010 a| 00238137;

035 a| (Sirsi) o43437941;

035 a| (OCoLC)43437941;

042 a| lcd;

043 a| n-us---;

049 a| ERE#;

074 a| 0126-E-02 (MF);

074 a| 0126-E-02 (online);

086 0 a| C 60.8: T 23/2;

245 00 a| Guidelines for preparing applications /c| TIIAP, Telecommunications and Information Infrastructure Assistance Program.;

246 13 a| TIIAP;

246 13 a| Telecommunications and information infrastructure assistance program;

260 a| Washington, D.C. :b| U.S. Dept. of Commerce, National Telecommunications and Information Administration.;

300 a| volumes :b| forms ;c| 28 cm;

310 a| Annual;

336 a| text2| rdacontent;

337 a| microform2| rdamedia;

338 a| microfiche2| rdacarrier;

362 1 a| Began in 1994?;

500 a| Issue for 1997 includes publication: Notice of availability of grant funds.;

500 a| Description based on: Fiscal Year 1997; title from cover.;

530 a| Current issue only also available via the Internet from the NTIA web site. Address as of: 12/13/00: http://www.ntia.doc.gov/otiahome/top/grants/applicationkit.htm; current access is available via PURL.;

650 0 a| Grants-in-aidz| United Statesv| Periodicals.=| ^A1004744;

710 2 a| Telecommunications and Information Infrastructure Assistance Program (U.S.)=| ^A427376;

710 2 a| Technology Opportunities Program (U.S.)=| ^A468052;

740 02 a| Notice of availability of grant funds.;

776 1 c| Originalw| (OCoLC)34999310;

776 1 a| Guidelines for preparing applications (Online)w| (DLC) 00238137w| (OCoLC)45554540;

856 41 u| https://purl.fdlp.gov/GPO/LPS7251;

850 a| InU;

998 a| 781465;

998 a| u781465;

596 a| 1;

999 a| C 60.8: T 23/2w| SUDOCc| 1i| MQ1413561d| 8/7/2007l| JDOMIm| JOYNERr| Ys| Yt| JDOFMIu| 1/29/2001x| MICROFORMz| JFEDDOCSo| .STAFF. 0;

Guidelines for preparing applications / TIIAP, Telecommunications and Information Infrastructure Assistance Program.

Other author	Telecommunications and Information Infrastructure Assistance Program (U.S.)
Other author	Technology Opportunities Program (U.S.)
Format	Microform
Publication Info	Washington, D.C. : U.S. Dept. of Commerce, National Telecommunications and Information Administration.
Description	volumes : forms ; 28 cm
Supplemental Content	https://purl.fdlp.gov/GPO/LPS7251
Subjects	Telecommunication--United States. --Finance. --Periodicals. Grants-in-aid--United States. --Periodicals.

Other title	TIIAP
Other title	Telecommunications and information infrastructure assistance program
Frequency	Annual
General note	Issue for 1997 includes publication: Notice of availability of grant funds.
General note	Description based on: Fiscal Year 1997; title from cover.
Other forms	Current issue only also available via the Internet from the NTIA web site. Address as of: 12/13/00: http://www.ntia.doc.gov/otiahome/top/grants/applicationkit.htm; current access is available via PURL.
Reproduction note	Joyner- Microfiche. 1997. Washington, D.C. : Supt. of Docs., U.S. G.P.O. 1998. microfiches : negative.
Other title	Notice of availability of grant funds.
LCCN	00238137
GPO item number	0126-E-02 (MF)
GPO item number	0126-E-02 (online)
Govt. docs number	C 60.8: T 23/2

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Library	Location	Call Number	Status	Item Actions
Joyner	Microforms B300	C 60.8: T 23/2	✔ Available

Guidelines for preparing applications / TIIAP, Telecommunications and Information Infrastructure Assistance Program.

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