HOTPAC : programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML / John Albers.

Author/creator Albers, John
Other author National Institute of Standards and Technology (U.S.)
Format Microform
Publication InfoGaithersburg, MD : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; Washington, DC : For sale by the Supt. of Docs., U.S. G.P.O., 1995.
Descriptionvi, 87 pages ; 28 cm.
Subjects

Variant title HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program ...
Portion of title Programs for thermal analysis including version 3.0 of the TXYZ program ...
SeriesNIST special publication ; 400-96
Semiconductor measurement technology
Semiconductor measurement technology. ^A428054
NIST special publication 400-96. ^A390056
General noteDistributed to depository libraries in microfiche.
General noteShipping list no.: 95-0785-M.
General note"August 1995."
Bibliography noteIncludes bibliographical references (p. 47-49).
Reproduction noteJoyner- Microfiche. [Washington, D.C.?] : Supt. of Docs., U.S. G.P.O., [1995] 2 microfiches : negative.
GPO item number0247 (MF)
Govt. docs number C 13.10:400-96

Availability

Library Location Call Number Status Item Actions
Joyner Microforms B300 C 13.10:400-96 ✔ Available