Polymeric materials for electronic packaging / Shozo Nakamura.
| Author/creator | Nakamura, Shozo |
| Format | Electronic |
| Publication Info | Hoboken, New Jersey : Wiley, [2024] |
| Description | pages cm |
| Supplemental Content | Full text available from eBooks on EBSCOhost |
| Subjects |
| Abstract | "Polymers are normally electrical insulators but, to enable their use in electronic applications, conductive fillers such as silver have been added to polymer formulations to increase their electrical conductivity. Unlike metal components, by using high performance polymers, engineers can reduce processing cycle times and increase durability in demanding environments. Some of the key benefits of replacing metals with polymers include weight reductions of up to 80%, and 30% faster installation times, ideal for hand-held devices and equipment."-- Provided by publisher. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2023013757 |
| ISBN | 9781394188796 (hardback) |
| ISBN | (adobe pdf) |
| ISBN | (epub) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |