VLSI interconnect technology with artificial plasmonics bridging the gap between electronics and optics / Soumitra R. Joy, Pinaki Mazumder.
| Author/creator | Joy, Soumitra R. |
| Other author | Mazumder, Pinaki |
| Format | Electronic |
| Publication Info | Hoboken, New Jersey : John Wiley & Sons Inc, [2026] |
| Description | pages cm |
| Supplemental Content | Full text available from eBooks on EBSCOhost |
| Subjects |
| Abstract | "This highlights the urgent need to examine the physics of power dissipation and innovate device materials to significantly cut energy consumption and ensure a sustainable computing future. A significant portion of this power consumption and heat generation comes from servers of datacenters, which include processors, memory, and interconnects. About 20% of a server's power usage is due to interconnects and switches. High-density interconnects in packagelevel integrations are especially power-intensive due to high parasitics, causing excessive power loss, signal delay, distortion, and crosstalk."-- Provided by publisher. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2025035003 |
| ISBN | 9781394289950 hardback |
| ISBN | adobe pdf |
| ISBN | epub |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |