Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir.
| Author/creator | Suhir, Ephraim |
| Format | Electronic |
| Edition | First edition. |
| Publication Info | Boca Raton, FL : CRC Press, 2020. |
| Description | pages cm |
| Supplemental Content | Full text available from Taylor & Francis eBooks |
| Subjects |
| Abstract | "The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- Provided by publisher. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2020028727 |
| ISBN | 9781138624733 (hbk) |
| ISBN | 9780367635886 (pbk) |
| ISBN | (ebk) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |