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010 a| 2011934923;

020 a| 9781845699376 (hbk.);

020 a| 1845699378 (hbk.);

020 a| 9780857093752 (online);

035 a| (WaSeSS)ssj0000596223;

042 a| lccopycat;

049 a| EREEa| NEHH;

050 00 a| TK7874b| .E478 2011;

245 00 a| Electromigration in thin films and electronic devicesh| [electronic resource] :b| materials and reliability /c| edited by Choong-Un Kim.;

260 a| Oxford ;a| Philadelphia :b| Woodhead Publishing,;

300 a| xiii, 340 p. :b| ill. ;c| 25 cm.;

490 1 a| Woodhead Publishing in materials;

504 a| Includes bibliographical references and index.;

505 0 a| Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Integrated circuitsx| Deterioration.=| ^A42814;

650 0 a| Electrodiffusion.=| ^A56304;

650 0 a| Thin films.=| ^A26073;

650 0 a| Interconnects (Integrated circuit technology)=| ^A872060;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Kim, Choong-Un.?| UNAUTHORIZED;

830 0 a| Woodhead Publishing in materials.=| ^A870288;

856 40 z| Full text available from eBook - Materials Science 2011u| https://go.openathens.net/redirector/ecu.edu?url=http%3A%2F%2Fwww.sciencedirect.com%2Fscience%2Fbook%2F9781845699376;

947 a| (OCoLC)ocn713610407;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 6591342;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6591342-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 7/17/2025x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6591342-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 7/17/2025x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6591342-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 7/17/2025x| EBOOKz| JERESOURCE;

Electromigration in thin films and electronic devices materials and reliability / edited by Choong-Un Kim.

Other author	Kim, Choong-Un.
Format	Electronic
Publication Info	Oxford ; Philadelphia : Woodhead Publishing,
Description	xiii, 340 p. : ill. ; 25 cm.
Supplemental Content	Full text available from eBook - Materials Science 2011
Subjects	Integrated circuits--Deterioration. Electrodiffusion. Thin films. Interconnects (Integrated circuit technology)

Series	Woodhead Publishing in materials Woodhead Publishing in materials. ^A870288
Contents	Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2011934923
ISBN	9781845699376 (hbk.)
ISBN	1845699378 (hbk.)
ISBN	9780857093752 (online)

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Electromigration in thin films and electronic devices materials and reliability / edited by Choong-Un Kim.

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