Electroless Copper and Nickel-Phosphorus Plating Processing, Characterisation and Modelling

Author/creator Sha, Wei Author
Other author Wu,Xiaomin Author
Other author Keong,Kim Ghee Author
Format Electronic
Publication InfoSawston : Woodhead Publishing Limited LaVergne : Ingram Publisher Services [Distributor]
Description288 p. 09.650 x 06.230 in.
Supplemental ContentFull text available from eBook - Engineering 2011 (Elsevier and Woodhead) [EBCE11W]
Subjects

SeriesWoodhead Publishing in Materials Ser.
Summary Annotation Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions.After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modeling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallization of nickel-phosphorus deposits, modeling the thermodynamics and kinetics of crystallization of nickel-phosphorus deposits, artificial neural network (ANN) modeling of crystallization temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
ISBN9781845698089
ISBN1845698088 (Trade Cloth) Active Record
Standard identifier# 9781845698089
Stock number00051468

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