Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
| Other author | Doi, Toshiro K., 1947- |
| Other author | Marinescu, Ioan D. |
| Other author | Kurokawa, Syuhei. |
| Format | Electronic |
| Publication Info | Oxford ; New York : Elsevier, |
| Description | xii, 317 p. : ill. ; 24 cm. |
| Supplemental Content | Full text available from eBook - Engineering 2011 (Elsevier and Woodhead) [EBCE11W] |
| Subjects |
| Portion of title | CMP polishing technologies for the manufacture of electronic devices |
| Abstract | CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover. |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2012359712 |
| ISBN | 9781437778595 |
| ISBN | 1437778593 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |