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245 00 a| Silicon wafer bonding technologyh| [electronic resource] :b| for VLSI and MEMS applications /c| edited by Subramanian S. Iyer and Andre J. Auberton-Hervé.;

260 a| London :b| Institution of Electrical Engineers,;

300 a| xxv, 149 p. :b| ill. ;c| 26 cm.;

440 0 a| EMIS processing series ;v| no. 1;

504 a| Includes bibliographical references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Silicon-on-insulator technology.=| ^A855844;

650 0 a| Integrated circuitsx| Very large scale integration.=| ^A144311;

650 0 a| Microelectromechanical systems.=| ^A424252;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Iyer, Subramanian S.?| UNAUTHORIZED;

700 1 a| Auberton-Hervé, Andre J.?| UNAUTHORIZED;

710 2 a| Institution of Electrical Engineers.=| ^A66638;

710 2 a| INSPEC.b| EMIS Group.?| UNAUTHORIZED;

856 40 z| Full text available from IET Digital Library - Booksu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fdigital-library.theiet.org%2Fdoi%2Fbook%2F10.1049%2FPBEP001E;

947 a| (OCoLC)ocm48026089;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 6477070;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6477070-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 9/14/2024x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6477070-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 9/14/2024x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6477070-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 9/14/2024x| EBOOKz| JERESOURCE;

Silicon wafer bonding technology for VLSI and MEMS applications / edited by Subramanian S. Iyer and Andre J. Auberton-Hervé.

Format	Electronic
Publication Info	London : Institution of Electrical Engineers,
Description	xxv, 149 p. : ill. ; 26 cm.
Supplemental Content	Full text available from IET Digital Library - Books
Subjects	Silicon-on-insulator technology. Integrated circuits--Very large scale integration. Microelectromechanical systems.

Other author/creator	Iyer, Subramanian S.
Other author/creator	Auberton-Hervé, Andre J.
Other author/creator	Institution of Electrical Engineers.
Other author/creator	INSPEC. EMIS Group.
Series	EMIS processing series ; no. 1
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2006284940
ISBN	0852960395

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Silicon wafer bonding technology for VLSI and MEMS applications / edited by Subramanian S. Iyer and Andre J. Auberton-Hervé.

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