Collection of papers presented at the ... International Workshop on THERMal INvestigation of ICs and Systems
| Author/creator | International Workshop on Thermal Investigations of ICs and Microstructures |
| Format | Electronic |
| Publication Info | [Piscataway, NJ] : Institute of Electrical & Electronics Engineers |
| Supplemental Content | Click here for full text |
| Subjects |
| Other author/creator | CMP (Firm) https://id.oclc.org/worldcat/entity/E39QQPVp7YmjxrKhMhVmx3y7TR. |
| Other author/creator | Institute of Electrical and Electronics Engineers. https://id.oclc.org/worldcat/entity/E39QH7JmppbjgFY6j8mDDMWwRg. |
| Other author/creator | Components, Packaging & Manufacturing Technology Society. https://id.oclc.org/worldcat/entity/E39QH7JmpbhGgyjdbbxkJMgTTR. |
| Other author/creator | IEEE Xplore (Online service) |
| Uniform title | Collection of papers presented at the ... International Workshop on THERMal INvestigation of ICs and Systems (Online) |
| Variant title | International Workshop on THERMal INvestigation of ICs and Systems |
| Variant title | THERMal INvestigation of ICs and Systems |
| Variant title | THERMINIC |
| Frequency | Annual |
| Access restriction | Available only to authorized users. |
| Other forms | Also available in print. |
| Technical details | Mode of access: World Wide Web. |
| Source of description | Description based on: 13th (2007); title from PDF title page (IEEE Xplore website, viewed September 10, 2016). |
| Source of description | Latest issue consulted: 21st (2015) (viewed on September 10, 2016). |
| Issued in other form | Print version: International Workshop on Thermal Investigations of ICs and Microstructures. Collection of papers presented at the ... International Workshop on Thermal Investigations of ICs and Systems 2474-1515 |
| Genre/form | Electronic journals. |
| LCCN | 2016203495 |
| ISSN | 2474-1523 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |