International Congress Molded Interconnect Devices (MID) scientific proceedings

Uniform titleInternational Congress Molded Interconnect Devices (MID) scientific proceedings (Online)
Variant title MID Scientific proceedings
FrequencyBiennial?
Access restrictionAvailable only to authorized users.
Other formsAlso available in print.
Technical detailsMode of access: World Wide Web.
Source of descriptionDescription based on: 12th (2016); title from title page.
Source of descriptionLatest issue consulted: 12th (2016).
LCCN 2018207247

Availability

Library Location Call Number Status Item Actions
Electronic Resources Access Content Online ✔ Available