Tools

LEADER 03379cas a2200649 a 4500

001 ssj0052865;

003 WaSeSS;

005 20251013084006.0;

006 m d ;

007 cr n ;

008 050901d19921997cauar ss 1 a0eng c;

010 a| 2005262204;

029 1 a| AU@b| 000028414153;

029 1 a| AU@b| 000043710810;

029 1 a| AU@b| 000044938620;

029 1 a| AU@b| 000045726748;

029 1 a| NZ1b| 12139703;

035 a| (WaSeSS)ssj0052865;

042 a| pcc;

049 a| EREEa| NEHH;

111 2 a| IEEE Multi-Chip Module Conference.=| ^A728199;

240 10 a| IEEE Multi-Chip Module Conference (Online)=| ^A728199;

245 10 a| IEEE Multi-Chip Module Conferenceh| [electronic resource] :b| (MCMC) : [proceedings].;

246 30 a| Multi-Chip Module Conference;

246 30 a| MCMC;

260 a| [Los Alamitos, Calif.] :b| [IEEE Computer Society Press];

310 a| Annual;

362 1 a| Print began with 1992.;

362 1 a| Print ceased with: 1997.;

506 a| Available only to authorized users.;

530 a| Also available in print.;

538 a| Mode of access: World Wide Web.;

550 a| Print version sponsored by: IEEE Circuits and Systems Society, IEEE Components, Hybrids, and Manufacturing Technology Society, IEEE Computer Society, IEEE Electron Devices Society.;

588 a| Description based on: 1996; title from v. table of contents page (IEEE Digital Library Web site, viewed on Aug. 30, 2005).;

588 a| Latest issue consulted: 1997.;

650 0 a| Electronic packagingv| Congresses.=| ^A724961;

650 0 a| Multichip modules (Microelectronics)v| Congresses.=| ^A906440;

650 0 a| Microelectronic packagingv| Congresses.=| ^A728200;

655 0 a| Electronic journals.=| ^A353035;

710 2 a| IEEE Circuits and Systems Society.1| https://id.oclc.org/worldcat/entity/E39QQPVp7TFPCbBGyTKjDhb4kt.=| ^A85435;

710 2 a| IEEE Components, Hybrids, and Manufacturing Technology Society.1| https://id.oclc.org/worldcat/entity/E39QH7JmpvGC6dqrmgdwXYcQ3F.=| ^A723462;

710 2 a| IEEE Computer Society.1| https://id.oclc.org/worldcat/entity/E39QQPVp7YRxjbcrXVPYHxVD3F.=| ^A53823;

710 2 a| IEEE Electron Devices Society.1| https://id.oclc.org/worldcat/entity/E39QQPVp7TBrDkHvVrTHg9Kvgg.=| ^A85580;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

776 1 a| IEEE Multi-Chip Module Conference.t| Proceedingsw| (DLC) 94655091w| (OCoLC)26348998;

785 10 a| IEEE Symposium on IC/Package Design Integration.t| IEEE Symposium on IC/Package Design Integration : [proceedings]w| (OCoLC)61119470;

856 40 z| Click here for full textu| http://JW3MH2CM6N.search.serialssolutions.com/?V=1.0&L=JW3MH2CM6N&S=JCs&C=PIMMC&T=marc;

947 a| (OCoLC)61396293;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER123;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL79;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC61;

596 a| 1 3 4;

998 a| 6369686;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6369686-1001l| JNETm| JOYNERr| Ys| Yt| JNESSJOu| 5/14/2024x| EJOURNALz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6369686-2001l| HSLELECm| HSLr| Ys| Yt| HELECu| 5/14/2024x| EJOURNALz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 6369686-3001l| MNETm| JMUSICr| Ys| Yt| MNESSJOu| 5/14/2024x| EJOURNALz| JERESOURCE;

IEEE Multi-Chip Module Conference (MCMC) : [proceedings].

Author/creator	IEEE Multi-Chip Module Conference
Format	Electronic
Publication Info	[Los Alamitos, Calif.] : [IEEE Computer Society Press]
Supplemental Content	Click here for full text
Subjects	Electronic packaging--Congresses. Multichip modules (Microelectronics)--Congresses. Microelectronic packaging--Congresses.

Other author/creator	IEEE Circuits and Systems Society. https://id.oclc.org/worldcat/entity/E39QQPVp7TFPCbBGyTKjDhb4kt.
Other author/creator	IEEE Components, Hybrids, and Manufacturing Technology Society. https://id.oclc.org/worldcat/entity/E39QH7JmpvGC6dqrmgdwXYcQ3F.
Other author/creator	IEEE Computer Society. https://id.oclc.org/worldcat/entity/E39QQPVp7YRxjbcrXVPYHxVD3F.
Other author/creator	IEEE Electron Devices Society. https://id.oclc.org/worldcat/entity/E39QQPVp7TBrDkHvVrTHg9Kvgg.
Other author/creator	IEEE Xplore (Online service)
Uniform title	IEEE Multi-Chip Module Conference (Online)
Portion of title	Multi-Chip Module Conference
Portion of title	MCMC
Frequency	Annual
Access restriction	Available only to authorized users.
Other forms	Also available in print.
Technical details	Mode of access: World Wide Web.
Issuing body	Print version sponsored by: IEEE Circuits and Systems Society, IEEE Components, Hybrids, and Manufacturing Technology Society, IEEE Computer Society, IEEE Electron Devices Society.
Source of description	Description based on: 1996; title from v. table of contents page (IEEE Digital Library Web site, viewed on Aug. 30, 2005).
Source of description	Latest issue consulted: 1997.
Genre/form	Electronic journals.
LCCN	2005262204

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Library	Location	Call Number	Status	Item Actions
	Electronic Resources	Access Content Online	✔ Available

IEEE Multi-Chip Module Conference (MCMC) : [proceedings].

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