International Conference on VLSI and CAD

Author/creator International Conference on VLSI and CAD
Format Electronic
Publication InfoPiscataway, N.J. : IEEE
Supplemental ContentClick here for full text
Subjects

Other author/creatorInstitute of Electrical and Electronics Engineers. Korea Council.
Other author/creatorIEEE Electron Devices Society. https://id.oclc.org/worldcat/entity/E39QQPVp7TBrDkHvVrTHg9Kvgg.
Other author/creatorIEEE Solid-State Circuits Society. https://id.oclc.org/worldcat/entity/E39QQPVp7T63PGrdTVTrYpTtWt.
Other author/creatorIEEE Xplore (Online service)
Uniform titleInternational Conference on VLSI and CAD (Online)
Portion of title ICVC
FrequencyBiennial
Access restrictionAvailable only to authorized users.
Other formsAlso available in print.
Technical detailsMode of access: World Wide Web.
Issuing bodySponsored by: Korea Semiconductor Industry Association, Hyundai Microelectronics Co. Ltd., IEEK, IEEE Korea Council, SEMI Korea [and] co-sponsored by: IEEE Electron Devices Society, IEEE Solid-State Circuit.
Source of descriptionDescription based on: 6th (1999) (viewed Aug. 30, 2000); title from title screen.
Genre/formElectronic journals.
LCCN 00242164

Availability

Library Location Call Number Status Item Actions
Electronic Resources Access Content Online ✔ Available