Uniform title | Proceedings of technical papers (Online) |
Variant title |
In IEEE Xplore: Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), International |
Other title |
International Microsystems, Packaging, Assembly, and Circuits Technology Conference |
Other title |
IMPACT |
Frequency | Annual |
General note | Published by Institute of Electrical and Electronics Engineers in association with individual conference organizations. |
Access restriction | Available only to authorized users. |
Other forms | Also available in print. |
Technical details | Mode of access: World Wide Web. |
Source of description | Description based on print version record. |
Issued in other form | Also in print: International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Proceedings of technical papers 2150-5934 |
Genre/form | Electronic journals. |
LCCN | 2009204101 |
ISSN | 2150-5942 2150-5934 |
Stock number | Institute of Electrical and Electronics Engineers, IEEE Service Center, 445 Hoes Lane, Piscataway, NJ 08854 |