Proceedings of International Symposium on Electronic Materials and Packaging

Author/creator International Symposium on Electronic Materials and Packaging
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway, NJ : IEEE
Supplemental ContentClick here for full text
Subjects

Uniform titleProceedings of International Symposium on Electronic Materials and Packaging (Online)
Other title EMAP
FrequencyAnnual
Access restrictionAvailable only to authorized users.
Other formsAlso available in print.
Technical detailsMode of access: World Wide Web.
Source of descriptionDescription based on: 2nd (Nov. 30/Dec. 2, 2000); title from cover.
Succeeding title International Conference on Electronic Materials and Packaging. International Conference on Electronic Materials and Packaging : [proceedings] 2151-7231
Genre/formElectronic journals.
LCCN 2008261000

Availability

Library Location Call Number Status Item Actions
Electronic Resources Access Content Online ✔ Available