| Other author/creator | Electronics Packaging Society. |
| Other author/creator | IEEE Council on Electronic Design Automation. |
| Other author/creator | IEEE Microwave Theory and Techniques Society. |
| Other author/creator | IEEE Xplore (Online service) |
| Uniform title | IEEE transactions on signal and power integrity (Online) |
| Variant title |
(T-SPI) |
| Variant title |
Transactions on signal and power integrity |
| Variant title |
TSPI |
| Abstract |
Research and application papers addressing all aspects of signal integrity and power integrity of an electronic system and its components including integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and signal integrity/power integrity co-design. |
| Access restriction | Available only to authorized users. |
| Other forms | Also available in print. |
| Technical details | Mode of access: World Wide Web. |
| Issuing body | A publication of the IEEE Electromagnetic Society, the IEEE Microwave Theory and Techniques Society, IEEE Council on Electronic Design Automation, and the Electronics Packaging Society. |
| Source of description | Description based on: Volume 1 (2022) ; title from PDF title page (ieeexplore.ieee.org viewed Oct. 13, 2022). |
| Source of description | Latest issue consulted: Volume 1 (2022) (ieeexplore.ieee.org viewed Oct. 13, 2022). |
| LCCN | 2021201192 |
| ISSN | 2768-1866 |
