Proceedings of the 13th International Symposium on the Physical & Failure Analysis of Integrated Circuits IPFA 2006 / edited by Gan Chee Lip ... [et al.] ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE Electron Devices Society ... [et al.] ; in co-operation with Centre for IC Failure Analysis & Reliability (CICFAR), National University of Singapore.

Author/creator International Symposium on the Physical & Failure Analysis of Integrated Circuits
Format Electronic
Publication InfoPiscataway, N.J. : IEEE,
Description363 p. : ill. ; 30 cm.
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Supplemental ContentFull text available from IEEE Conference Proceedings Archive 2005-2009
Subjects
Integrated circuits--Defects. --Congresses.
Integrated circuits--Testing. --Congresses.
Integrated circuits--Reliability. --Congresses.

Other author/creatorGan, Chee Lip.
Other author/creatorIEEE Reliability/CPMT/ED Singapore Chapter.
Other author/creatorIEEE Electron Devices Society.
Other author/creatorIEEE Xplore (Online service)
General note"IEEE Catalog Number 06TH8872"--T.p. verso.
General noteIssues for 18th (2011)- cataloged as a serial in LC.
Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2006920946
ISBN1424402050 (softbound ed.)