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EMAP 2005 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan : [proceedings].
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway, NJ : IEEE, |
| Description | 301 p. : ill. ; 30 cm. |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive 2005-2009 |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2006276755 |
| ISBN | 1424401070 (pbk.) |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |