10th IEEE Workshop on Signal Propagation on Interconnects May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC).

Author/creator IEEE Workshop on Signal Propagation on Interconnects
Other author Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.
Other author IEEE Computer Society. Technical Council on Test Technology.
Other author IEEE Xplore (Online service)
Format Electronic
Publication InfoPiscataway, N.J. : IEEE,
Description289 p. : ill. (some col.) ; 30 cm.
Supplemental ContentFull text available from IEEE Conference Proceedings Archive 2005-2009
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Subjects
Printed circuits--Congresses.
Interconnects (Integrated circuit technology)--Congresses.
Signal theory (Telecommunication)--Congresses.

Portion of title IEEE Workshop on Signal Propagation on Interconnects
Spine title SPI 2006 proceedings
General note"IEEE Cat No: 06EX1412."
Bibliography noteIncludes bibliographical references and index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2007272796
ISBN1424404541 (pbk.)

Availability

Library Location Call Number Status Item Actions
Electronic Resources Access Content Online ✔ Available