2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October / International Microsystems, Packaging, Assembly & Circuits Technology Conference.
| Other author | International Microsystems, Packaging, Assembly & Circuits Technology Conference. |
| Other author | Institute of Electrical and Electronics Engineers. |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | [S.l.] : Institute of Electrical and Electronics Engineers, |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Supplemental Content | Full text available from IEEE Conference Proceedings Archive 2005-2009 |
| General note | Title from content provider. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |