Encapsulation technologies for electronic applications / Haleh Ardebili, University of Houston, Houston, TX, United States, Jiawei Zhang, Qualcomm, San Diego, CA, United States, Michael G. Pecht, CALCE, University of Maryland, College Park, MD, United States.
| Author/creator | Ardebili, Haleh |
| Other author | Zhang, Jiawei (Engineer) |
| Other author | Pecht, Michael. |
| Format | Electronic |
| Edition | Second edition. |
| Publication Info | Oxford [England] ; Cambridge, MA : William Andrew [2019] |
| Description | x, 498 pages : illustrations ; 23 cm. |
| Supplemental Content | Full text available from eBook - Materials Science 2018 |
| Subjects |
| Series | Materials and processes for electronic applications series |
| Bibliography note | Includes bibliographical references and index. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 2018942646 |
| ISBN | 9780128119785 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |