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003 WaSeSS;

005 20210412081717.0;

006 m d ;

007 cr n ;

008 170224s2017 si sb 001 0 eng d;

010 a| 2017007232;

020 a| 9781119045939 (cloth);

035 a| (WaSeSS)ssj0001839628;

040 a| WaSeSS/DLCb| engc| WaSeSSd| WaSeSS;

042 a| pcc;

049 a| EREEa| NEHH;

050 00 a| TK7874b| .L437 2017;

082 00 a| 621.38152| 23;

100 1 a| Li, Suny,d| 1974-?| UNAUTHORIZED;

245 10 a| SiP-system in package design and simulationh| [electronic resource] :b| MentorGraphics Expedition Enterprise Flow advanced design guide /c| Suny Li.;

260 a| Singapore ;a| Hoboken, NJ :b| John Wiley & Sons,c| 2017.;

263 a| 1709;

300 a| pages cm;

504 a| Includes bibliographical references and index.;

505 0 a| SiP design and simulation platform -- Basic knowledge of package -- SiP production process -- New package technologies -- SiP design and simulation flow -- Central library -- Schematic input -- Multi-board project management and schematic concurrent design -- Layout creation and setting -- Constraint rules management -- Wire bond design -- Cavity and chip stack design -- FlipChip and RDL design -- Route and plane -- Embedded passives design -- RF circuit design -- Layout concurrent design -- 3D real-time DRC -- Design review -- Manufacture data output -- SiP simulation technology.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Integrated circuitsx| Design and construction.=| ^A164350;

650 0 a| Multichip modules (Microelectronics)x| Design and construction.=| ^A906440;

655 0 a| Electronic books.=| ^A491897;

856 40 z| Full text available from Ebook Central - Academic Completeu| https://ebookcentral.proquest.com/lib/eastcarolina/detail.action?docID=4915580;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 5618610;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5618610-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 4/19/2021x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5618610-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 4/19/2021x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 5618610-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 4/19/2021x| EBOOKz| JERESOURCE;

SiP-system in package design and simulation MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.

Author/creator	Li, Suny, 1974-
Format	Electronic
Publication Info	Singapore ; Hoboken, NJ : John Wiley & Sons, 2017.
Description	pages cm
Supplemental Content	Full text available from Ebook Central - Academic Complete
Subjects	Integrated circuits--Design and construction. Multichip modules (Microelectronics)--Design and construction.

Contents	SiP design and simulation platform -- Basic knowledge of package -- SiP production process -- New package technologies -- SiP design and simulation flow -- Central library -- Schematic input -- Multi-board project management and schematic concurrent design -- Layout creation and setting -- Constraint rules management -- Wire bond design -- Cavity and chip stack design -- FlipChip and RDL design -- Route and plane -- Embedded passives design -- RF circuit design -- Layout concurrent design -- 3D real-time DRC -- Design review -- Manufacture data output -- SiP simulation technology.
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2017007232
ISBN	9781119045939 (cloth)

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SiP-system in package design and simulation MentorGraphics Expedition Enterprise Flow advanced design guide / Suny Li.

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