2016 12th International Congress Molded Interconnect Devices (MID)
| Author/creator | IEEE Staff |
| Other author | IEEE Xplore (Online service) |
| Format | Electronic |
| Publication Info | Piscataway : IEEE |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) |
| Supplemental Content | Full text available from IEEE Electronic Library (IEL) Conference Proceedings |
| Subjects |
| Summary | Annotation Due to a direct application of conductor tracks and functional structures on randomly shaped substrates, the technology MID (Molded Interconnect Devices Mechatronic Integrated Devices) enables the production of highly integrated mechatronic products Since 1994, the Research Association 3 D MID biennially organizes the International Congress Molded Interconnect Devices in Germany in order to support the further development of the technology by offering a platform for the global transfer of knowledge and information With about 300 participants from all over the world this international recognized conference is the worlds leading event in the field of MID Further information http www 3d mid de 2 technology technology html |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| ISBN | 9781509054299 |
| ISBN | 1509054294 (Spiral) Active Record |
| Stock number | 00066573 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | ✔ Available |