2015 Symposium on Design, Test, Integration and Packaging of MEMS MOEMS (DTIP)

Summary Annotation The goal of the Symposium is to provide a forum for in depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
ISBN9781479985456
ISBN1479985457 (Spiral) Active Record
Stock number00066573

Availability

Library Location Call Number Status Item Actions
Electronic Resources ✔ Available