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010 a| 2001034086;

020 a| 0791801683;

035 a| (WaSeSS)ssj0000614789;

040 a| DLCc| DLCd| DLCd| WaSeSS;

042 a| pcc;

049 a| EREEa| NEHH;

050 00 a| TK7870.25b| .Y44 2002;

082 00 a| 621.381/042| 21;

100 1 a| Yeh, L.-T.q| (Lian-Tuu),d| 1944-?| UNAUTHORIZED;

245 10 a| Thermal management of microelectronic equipmenth| [electronic resource] :b| heat transfer theory, analysis methods and design practices /c| L.T. Yeh and R.C. Chu.;

260 a| New York :b| ASME Press,;

300 a| xxi, 414 p. :b| ill. ;c| 24 cm.;

440 0 a| ASME Press book series on electronic packaging;

504 a| Includes bibliographical references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Electronic apparatus and appliancesx| Cooling.=| ^A332382;

650 0 a| Microelectronics.=| ^A35901;

650 0 a| Electronic apparatus and appliancesx| Thermal properties.=| ^A906403;

650 0 a| Heatx| Transmission.=| ^A18327;

650 0 a| Semiconductorsx| Protection.=| ^A16124;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Chu, R. C.q| (Richard C.),d| 1933-?| UNAUTHORIZED;

856 40 z| Full text available from ASME eBooksu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fasmedigitalcollection.asme.org%2Febooks%2Fbook%2F125%2FThermal-Management-of-Microelectronic-Equipment;

949 a| CLICK ON WEB ADDRESSw| ASISh| JOYNER188;

949 a| CLICK ON WEB ADDRESSw| ASISh| HSL77;

949 a| CLICK ON WEB ADDRESSw| ASISh| JMUSIC60;

596 a| 1 3 4;

998 a| 4807276;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4807276-1001l| JNETm| JOYNERr| Ys| Yt| JNESSBKu| 12/19/2017x| EBOOKz| JERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4807276-2001l| HSLELECm| HSLr| Ys| Yt| HEBKu| 12/19/2017x| EBOOKz| HERESOURCE;

999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4807276-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 12/19/2017x| EBOOKz| JERESOURCE;

Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices / L.T. Yeh and R.C. Chu.

Author/creator	Yeh, L.-T., 1944-
Other author	Chu, R. C. (Richard C.), 1933-
Format	Electronic
Publication Info	New York : ASME Press,
Description	xxi, 414 p. : ill. ; 24 cm.
Supplemental Content	Full text available from ASME eBooks
Subjects	Electronic apparatus and appliances--Cooling. Microelectronics. Electronic apparatus and appliances--Thermal properties. Heat--Transmission. Semiconductors--Protection.

Series	ASME Press book series on electronic packaging
Bibliography note	Includes bibliographical references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2001034086
ISBN	0791801683

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Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices / L.T. Yeh and R.C. Chu.

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