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010 a| 99203414;

020 a| 0930815564 (softbound);

020 a| 0780355083 (microfiche);

035 a| (WaSeSS)ssj0000393599;

040 a| MoKLc| MoKLd| DLCd| WaSeSS;

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050 00 a| TK7870.15b| .I586 1999;

082 00 a| 621.381/0462| 21;

111 2 a| International Symposium on Advanced Packaging Materialsn| (5th :d| 1999 :c| Braselton, Georgia)?| UNAUTHORIZED;

245 10 a| International Symposium on Advanced Packaging Materialsh| [electronic resource] :b| processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999 /c| co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].;

246 31 a| Advanced packaging materials;

260 a| Reston, Virginia :b| IMAPS ;a| Piscataway, New Jersey :b| IEEE,;

300 a| vii, 362 p. :b| ill. ;c| 28 cm.;

500 a| "... IEEE Catalog Number 99TH8405"--verso of T.p.;

504 a| Includes bibliographic references and index.;

506 a| Available only to authorized users.;

538 a| Mode of access: World Wide Web;

650 0 a| Electronic packagingx| Materialsv| Congresses.=| ^A241674;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Wong, C. P.,d| 1947-?| UNAUTHORIZED;

710 2 a| International Microelectronics and Packaging Society.?| UNAUTHORIZED;

710 2 a| IEEE Xplore (Online service)=| ^A534875;

856 40 z| Full text available from IEEE Electronic Library (IEL) Conference Proceedingsu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6129;

856 40 z| Full text available from IEEE Conference Proceedings Archiveu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6129;

856 40 z| Full text available from IEEE Electronic Library (IEL)u| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fieeexplore.ieee.org%2Fservlet%2Fopac%3Fpunumber%3D6129;

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998 a| 4689565;

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999 a| CLICK ON WEB ADDRESSw| ASISc| 1i| 4689565-3001l| MNETm| JMUSICr| Ys| Yt| MNESSBKu| 4/14/2017x| EBOOKz| JERESOURCE;

International Symposium on Advanced Packaging Materials processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999 / co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].

Author/creator	International Symposium on Advanced Packaging Materials
Other author	Wong, C. P., 1947-
Other author	International Microelectronics and Packaging Society.
Other author	IEEE Xplore (Online service)
Format	Electronic
Publication Info	Reston, Virginia : IMAPS ; Piscataway, New Jersey : IEEE,
Description	vii, 362 p. : ill. ; 28 cm.
Supplemental Content	Full text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental Content	Full text available from IEEE Conference Proceedings Archive
Supplemental Content	Full text available from IEEE Electronic Library (IEL)
Subjects	Electronic packaging--Materials. --Congresses.

Parallel title	Advanced packaging materials
General note	"... IEEE Catalog Number 99TH8405"--verso of T.p.
Bibliography note	Includes bibliographic references and index.
Access restriction	Available only to authorized users.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	99203414
ISBN	0930815564 (softbound)
ISBN	0780355083 (microfiche)

Availability

Library	Location	Call Number	Status	Item Actions
	Electronic Resources	Online Content Full text available from IEEE Electronic Library (IEL) Conference Proceedings Full text available from IEEE Electronic Library (IEL) Conference Proceedings Full text available from IEEE Electronic Library (IEL) Conference Proceedings	✔ Available

International Symposium on Advanced Packaging Materials processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999 / co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.].

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