Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003) 10-12 December, 2003, Pan Pacific Hotel, Singapore / edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS.

Author/creator Electronic Packaging Technology Conference
Format Electronic
Publication InfoPiscataway, N.J. : IEEE,
Descriptionxviii, 827 p. : ill. ; 30 cm.
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Subjects
Electronic packaging--Congresses.
Microelectronics--Congresses.

Other author/creatorIyer, Mahadevan K.
Other author/creatorToh, Kok Chuan.
Other author/creatorMui, Yew Cheong.
Other author/creatorIEEE Reliability/CPMT/ED Singapore Chapter.
Other author/creatorComponents, Packaging & Manufacturing Technology Society.
Other author/creatorInternational Microelectronics and Packaging Society.
Other author/creatorIEEE Xplore (Online service)
Portion of title EPTC 2003
Cover title Proceedings, EPTC 2003
Cover title 5th Electronics Packaging Technology Conference
General note"IEEE Catalog Number 03EX766 Bound Edition ; 03EX766C CD-ROM Edition"--T.p. verso.
Bibliography noteIncludes bibliographic references and author index.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2003112575
ISBN0780382056 (bound ed.)
ISBN0780382064 (CD-ROM ed.)

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