9th International Symposium on Advanced Packaging Materials processes, properties and interfaces : 2004 proceedings, March 24-26, 2004, Atlanta, GA, USA / sponsors, IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society, Packaging Research Center at Georgia Tech (GT-RRC) ; technical sponsor, Fraunhofer IZM, Germany ; general chair Petri Savolainen.

Author/creator International Symposium on Advanced Packaging Materials
Format Electronic
Publication InfoPiscataway, N.J. : IEEE,
Descriptionvi, 281 p. : ill. ; 28 cm.
Supplemental ContentFull text available from IEEE Electronic Library (IEL) Conference Proceedings
Supplemental ContentFull text available from IEEE Electronic Library (IEL)
Subjects

Other author/creatorSavolainen, Petri.
Other author/creatorComponents, Packaging & Manufacturing Technology Society.
Other author/creatorGeorgia Institute of Technology. Packaging Research Center.
Other author/creatorFraunhofer Institute IZM.
Other author/creatorIEEE Xplore (Online service)
Variant title 2004 9th International Advanced Packaging Materials Symposium
Portion of title Advanced Packaging Materials, rocesses, properties, interfaces
Portion of title Processes, properties and interfaces
Bibliography noteIncludes bibliographical references.
Access restrictionAvailable only to authorized users.
Other formsAlso available via the World Wide Web.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.
LCCN 2004300557
ISBN0780384369

Availability

Library Location Call Number Status Item Actions
Electronic Resources ✔ Available