Attachment of free filament thermocouples for temperature measurements on CMC / Jih-Fen Lei and Michael D. Cuy, Stephen P. Wnuk.

Author/creator Lei, Jih-Fen
Other author Cuy, Michael D.
Other author Wnuk, Stephen P.
Other author United States. National Aeronautics and Space Administration.
Format Microform
Publication Info[Washington, DC] : National Aeronautics and Space Administration ; [Springfield, Va.] : [National Technical Information Service, distributor], [1997]
Description1 volume.

SeriesNASA technical memorandum ; 107488
NASA technical memorandum 107488. ^A467613
General noteShipping list no.: 98-0575-M.
General noteCRDP Program record.
Reproduction noteMicrofiche. [Washington, D.C. : National Aeronautics and Space Administration, 1997]. 1 microfiche.
Issued in other formPrint version: Lei, Jih-Fen. Attachment of free filament thermocouples for temperature measurements on CMC
Issued in other formOnline version: Lei, Jih-Fen. Attachment of free filament thermocouples for temperature measurements on CMC
GPO item number0830-D (MF)
Govt. docs number NAS 1.15:107488
Stock number19970025591 NASA

Availability

Library Location Call Number Status Item Actions
Joyner Microforms B300 NAS 1.15:107488 ✔ Available