Printed wiring board industry and use cluster profile.
| Other author | Design for the Environment Program (U.S.) |
| Other author | Microelectronics and Computer Technology Corporation. |
| Other author | Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.) |
| Format | Microform |
| Publication Info | Washington, DC : Design for the Environment Program, Economics, Exposure, and Technology Division, Office of Pollution Prevention and Toxics, U.S. Environmental Protection Agency, [1995] |
| Description | 1 volume (various pagings) : illustrations ; 28 cm. |
| Subjects |
| Series | Design for the environment Design for the environment. ^A423849 |
| General note | "Design for the Environment printed wiring board project"--Cover. |
| General note | "Prepared by Microelectronics and Computer Technology Corporation and the Institute for Interconnecting and Packaging Electronic Circuits"--1st prelim. p. |
| General note | Shipping list no.: 97-0792-M. |
| General note | "September 1995"--Cover. |
| General note | "This document was produced under grant #X 823856-01-0 from EPA's Environmental Technology Initiative program." |
| General note | "EPA 744-R-95-005"--Cover. |
| Bibliography note | Includes bibliographical references. |
| Reproduction note | Joyner- Microfiche. [Washington, D.C.] : Supt. of Docs., U.S. G.P.O., [1997] 1 microfiche : negative. |
| Technical rpt number | EPA 744-R-95-005 |
| GPO item number | 0473-B-01 (MF) |
| Govt. docs number | EP 5.2:P 93 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Joyner | Microforms B300 | EP 5.2:P 93 | ✔ Available |