TEI '08 second International Conference on Tangible and Embedded Interaction : February 18-20 2008, Bonn, Germany : conference proceedings / International Conference on Tangible and Embedded Interaction.

Other author International Conference on Tangible and Embedded Interaction.
Other author ACM Digital Library.
Format Electronic
Publication Info[S.l.] : ACM,
Supplemental ContentFull text available from ACM Digital Library

General noteTitle from content provider.
Access restrictionAvailable only to authorized users.
Technical detailsMode of access: World Wide Web
Genre/formElectronic books.

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