Stress-Induced Phenomena in Metallization Third International Workshop: Palo Alto, CA, June 1995
| Author/creator | Ho, Paul S. Editor |
| Other author | Bravman, John Editor |
| Other author | Li, Che-Yu Editor |
| Other author | Sanchez, John Editor |
| Format | Electronic |
| Publication Info | A I P Press [Imprint] New York : Springer |
| Description | 304 p. ill 09.460 x 06.560 in. |
| Supplemental Content | Full text available from AIP Conference Proceedings |
| Subjects |
| Series | AIP Conference Proceedings Ser. No. 373 |
| Summary | Annotation Proceedings of the June 1995 workshop, reporting on new and basic results in electromigration and stress-induced void formation. Sections on stress characteristics and void formation in thin films and interconnects, and electromigration and damage mechanisms in interconnects, contain research in areas such as stresses in passivated gold and metal lines; electrical measurement of stress- induced void growth; modeling electromigration in multi-level interconnects; comparison of electromigration in submicron Al(Cu) and Cu thin-film lines; and resistance oscillations induced by DC electromigration. No index. Annotation c. by Book News, Inc., Portland, Or. |
| Access restriction | Available only to authorized users. |
| Technical details | Mode of access: World Wide Web |
| Genre/form | Electronic books. |
| LCCN | 96084949 |
| ISBN | 9781563964398 |
| ISBN | 1563964392 (Trade Cloth) Active Record |
| Standard identifier# | 9781563964398 |
| Stock number | 1563964392 00024965 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |